Detailed Project Report (DPR) on electronic manufacturing service (ems) facility in assembly of pcb and components

ELECTRONIC MANUFACTURING SERVICE (EMS) FACILITY IN ASSEMBLY OF PCB AND COMPONENTS
[CODE NO.3261]  


A PCB is a printed circuit board is used in electronics to build electronic devices. A PCB serves two purposes in the construction of an electronic device; it is a place to mount the components and it provides the means of electrical connection between the components.

TYPES OF PCB

1. Single-sided PCB

2. Double-sided PCB


1. Single-sided PCB

The single-sided PCBs are mostly used in entertainment electronics where manufacturing costs have to be kept at a minimum. However, in industrial electronics also, cost factors cannot be neglected and single-sided boards should be used wherever a particular circuit can be accommodated on such boards.  

To jump over conductor tracks, components have to be utilized (Fig A). If this is not feasible, jumper wires are used. The number of jumper wires on a board, however, is restricted by economic reasons. If their number is more than a few, the use of a double-sided PCB should be considered.

Advantages of single-sided PCBs include:

•    Low cost, especially for volume production;

•    Low rate of issues during PCB manufacturing process, accordingly, leading to high speed of fabrication;

•    Suitable for simple circuits.

2. Double-sided PCB

Double-sided PCBs can be made with or without plated-through holes. The production of board with plated-through holes is fairly expensive. Therefore, plated-through hole boards are only chosen where the circuit complexity and density does not leave any other choice. Even on such boards, the total number of plated-through holes, in particular of via-holes (holes utilized only for through-contact and not for component mounting), should be kept to the minimum for reasons of economy and reliability.

The cost factor for double-sided PCBs without plated-through holes is considerably lower because plating can be avoided. Through-contacts are made by soldering the component leads on both the board sides where required. Jumper wires may still be added. However, hand soldering must be applied for soldering of the component side joints.

In the layout design of such boards, solder joints on the component sides have to be kept minimum in number because the replacing of such components is extremely difficult. A typical strategy is therefore to realize the conductors as much as possible on the non-component side and to put only the remaining once on the component side. Such boards are therefore compromise between serviceability and electrical design optimum on the one hand and the cost factor on the other.


Therefore, advantages of double-layer PCBs can be summarized into the following aspects:

•    More flexibility for designers;

•    An increase of circuit density;

•    Relatively low cost;

•    Reduction of board size.



COST ESTIMATION

Plant  Capacity                                                     :    10.00 MT./day         
land & Building (2000 sq.mt)                            :    Rs. 3.32   Cr
Plant & Machinery                                               :    Rs. 91.00  Lac
Working Capital for 2 Months                           :    Rs. 2.67   Cr
Total Capital Investment                                    :    Rs. 7.20   Cr
Rate of Return                                                      :    37%
Break Even Point                                                 :    42%


INTRODUCTION    
TYPES OF PCB    
PCB ASSEMBLY    
FOLLOWING ELECTRONICS PARTS AND CONSUMABLES ARE NEEDED
FOR PCB ASSEMBLY     
METHOD OF PCB ASSEMBLY    
ADVANTAGES:    
DISADVANTAGES:    
TYPES OF SMD    
ACTIVE COMPONENTS    
TYPICAL APPLICATIONS OF THE SMD COMPONENTS INCLUDE THE FOLLOWING:    
THE ADVANTAGES OF SURFACE-MOUNT TECHNOLOGY    
THE DISADVANTAGES OF SURFACE-MOUNT TECHNOLOGY    
USES AND APPLICATION    
TYPICAL APPLICATIONS OF THE SMD COMPONENTS INCLUDE THE FOLLOWING:    
APPLICATION:    
COMPUTERS    
B.I.S. SPECIFICATION    
PROCESS FLOW CHART    
ASSEMBLING PROCESS OF PCB    
PROCESS OVERVIEW    
SMT PROCESS    
SOLDER PASTE    
PREHEAT ZONE    
THERMAL SOAK ZONE    
REFLOW ZONE    
COOLING ZONE    
TYPES OF REFLOW SOLDERING    
GENERALLY, THERE ARE TWO MAIN TYPES OF LASERS USED FOR REFLOW SOLDERING:    
CLEANING    
REWORK    
INSPECTION OF SOLDERED JOINTS    
MARKINGS    
PACKAGING /SHIPMENT    
MARKET POSITION    
THE INDIAN PCB INDUSTRY    
METHODOLOGY    
MARKET AT A GLANCE    
GROWTH DRIVERS    
CHALLENGES FACED BY THE INDUSTRY    
OTHER CHALLENGES INCLUDE:    
GROWING INORGANICALLY    
MOVING FORWARD    
INDIAN PCB INDUSTRY GROWTH    
SIGNS OF GROWTH    
GROWTH DRIVERS    
THE DEMAND-SUPPLY GAP    
OBSTACLES IN THE PATH OF GROWTH    
OTHER CHALLENGES INCLUDE:    
GROWING INORGANICALLY    
ADVANTAGES IN INDIA    
LOOKING AHEAD    
PLANT LAYOUT    
MANUFACTURERS/SUPPLIERS OF PCB BOARD    
SUPPLIERS OF PCB    
SUPPLIERS OF RAW MATERIALS    
BARE PCB BOARD    
SUPPLIERS OF SOLDER PASTE    
SUPPLIERS OF SURFACE MOUNTED DEVICES    
SUPPLIERS OF PLANT AND MACHINERY    
PCB ASSEMBLING PLANT    
SUPPLIERS OF AUTOMATIC OPTICAL INSPECTION EQUIPMENT    
SUPPLIERS OF AUTOMATIC XRAY INSPECTION MACHINE    
ELECTRICAL MEASURING INSTRUMENTS    
AIR POLLUTION CONTROL EQUIPMENTS    
AIR CONDITIONING EQUIPMENTS    
PLATEFARM WEIGHING MACHINE    
MATERIAL HANDLING EQUIPMENTS    
FIRE FIGHTING EQUIPMENTS    

            
APPENDIX – A:

 1.      COST OF PLANT ECONOMICS      
 2.      LAND & BUILDING                                      
 3.      PLANT AND MACHINERY                                  
 4.      FIXED CAPITAL INVESTMENT                             
 5.      RAW MATERIAL                                         
 6.      SALARY AND WAGES                                     
 7.      UTILITIES AND OVERHEADS                              
 8.      TOTAL WORKING CAPITAL                                
 9.      COST OF PRODUCTION                                   
10.      PROFITABILITY ANALYSIS                               
11.      BREAK EVEN POINT                                     
12.      RESOURCES OF FINANCE                           
13.      INTEREST CHART                                       
14.      DEPRECIATION CHART                                   
15.      CASH FLOW STATEMENT                                   
16.      PROJECTED BALANCE SHEET