Detailed Project Report (DPR) on PCB Laminate and PCB Board

PCB LAMINATE AND PCB BOARD

[EIRI/EDPR/4546] J.C.: 2763XL 

INTRODUCTION

PCB Stands for "Printed Circuit Board." A PCB is a thin board made of fiberglass, composite epoxy, or other laminate material. Conductive pathways are etched or "printed" onto board, connecting different components on the PCB, such as transistors, resistors, and integrated circuits.

In other words, A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.

A PCB is a printed circuit board is used in electronics to build electronic devices. A PCB serves two purposes in the construction of an electronic device; it is a place to mount the components and it provides the means of electrical connection between the components.

There are four main parts to a PCB:

Substrate: 

The first, and most important, is the substrate, usually made of fiberglass. Fiberglass is used because it provides a core strength to the PCB and helps resist breakage. Think of the substrate as the PCB’s “skeleton”.

Copper Layer: 

Depending on the board type, this layer can either be copper foil or a full-on copper coating. Regardless of which approach is used, the point of the copper is still the same — to carry electrical signals to and from the PCB, much like your nervous system carries signals between your brain and your muscles.

Solder Mask: 

The third piece of the PCB is the solder mask, which is a layer of polymer that helps protect the copper so that it doesn’t short-circuit from coming into contact with the environment. In this way, the solder mask acts as the PCB’s “skin”.

Silkscreen: 

The final part of the circuit board is the silkscreen. The silkscreen is usually on the component side of the board used to show part numbers, logos, symbols switch settings, component reference and test points. The silkscreen can also be known as legend or nomenclature.

COST ESTIMATION

Plant Capacity            8000 Nos/Day  

Land & Building (7200 sq.mt.)    Rs. 35.00 Cr    

Plant & Machinery                    Rs. 90.14 Cr 

Working Capital for 1 Months    Rs. 40.22 Cr 

Total Capital Investment          Rs. 165.63 Cr 

Rate of Return                          43%

Break Even Point                      38%

CONTENTS

INTRODUCTION

FIG: DOUBLE SIDED PCB AFTER FINISHING COMPONENTS PLACEMENT

THERE ARE FOUR MAIN PARTS TO A PCB:

SUBSTRATE:

COPPER LAYER:

SOLDER MASK:

SILKSCREEN:

TYPES OF PCB

1. SINGLE-SIDED

ADVANTAGES OF SINGLE-SIDED PCBS INCLUDE:

2. DOUBLE-SIDED

USES AND APPLICATION

B.I.S. SPECIFICATION

THE INDIAN STANDARDS RELEVANT TO PCBS ARE:-

FOR MORE INFORMATION CONTACT AT:

TECHNOLOGY OF COPPER CLAD LAMINATE

FOR CCL TYPE, OFTEN ACCORDING TO DIFFERENT RULES, THERE ARE DIFFERENT CATEGORIES:

ACCORDING TO THE FLAME RETARDANT GRADE:

THE COMPOSITION OF CCL

CCL PERFORMANCE AND STANDARD

COSMETIC REQUIREMENTS

SIZE REQUIREMENT

ELECTRICAL PERFORMANCE REQUIREMENTS

PHYSICAL PERFORMANCE REQUIREMENTS

CHEMICAL PERFORMANCE REQUIREMENTS

ENVIRONMENTAL PERFORMANCE REQUIREMENTS

PREPARATION AND TEST METHOD OF CCL

TABLE TYPE SPECIFICATION AND MANUFACTURERS OF MAIN FACILITIES

TABLE PARAMETERS OF PTFE AND FEP EMULSIONS

TECHNOLOGICAL PROCESS

PROCESS FLOW DIAGRAM

GLASS FIBRE MAT PRE-TREATMENT

GLASS FIBRE MAT MODIFICATION

PTFE EMULSION PREPARATION

DIPPING

DRYING AT ROOM TEMPERATURE

DRYING IN AN OVEN

OBSERVATION AND WEIGHING

VACUUM HOT PRESSING

IMAGE AND MECHANICAL PRINCIPLE DIAGRAM OF VACUUM HOT PRESS

STRUCTURE OF SAMPLE IN HOT PRESS

MANUFACTURING PROCESS IN BRIEF OF CCL LAMINATE

PROCESS FLOW CHART

MANUFACTURING TECHNIQUE FOR PURE PTFE BOARD

PROCESS FLOW DIAGRAM OF CUTTING MOULDING

PADDING:

PREFORMING:

SINTERING:

CUTTING:

MANUFACTURING TECHNIQUE FOR PTFE WITH INORGANIC PADDING

PROCESS FLOW DIAGRAM OF ROLLING PROCESS

DIP CLOTH PRODUCTION PROCESS

DIP CLOTH PRODUCTION PROCESS

EFFECT OF IMMERSION DEPTH

SEQUENCES IN PCB MANUFACTURE

STEP 1 – THE DESIGN

STEP 2 – PRINTING THE DESIGN

STEP 3 – CREATING THE SUBSTRATE

STEP 4 – PRINTING THE INNER LAYERS

STEP 5 – ULTRAVIOLET LIGHT

STEP 6 – REMOVING UNWANTED COPPER

STEP 7 – INSPECTION

STEP 8 – LAMINATING THE LAYERS

STEP 9 – PRESSING THE LAYERS

STEP 10 – DRILLING

STEP 11 – PLATING

STEP 12 – OUTER LAYER IMAGING

STEP 13 – PLATING

STEP 14 – ETCHING

STEP 15 – SOLDER MASK APPLICATION

STEP 16 – SILKSCREENING

STEP 17 – SURFACE FINISH

STEP 18 – TESTING

MANUFACTURING PROCESS OF PCB

1. RAW MATERIALS

2. PANELIZATION

SOME GUIDELINES FOR PANELIZATION ARE SIMPLE FOR EXAMPLE WITH ROUTED PANELS:

BUT:

AS WITH ALL TECHNICAL SUBJECTS, EXCEPTIONS ABOUND FOR EXAMPLE:

THIS IS POSSIBLE WITH SOME RESTRICTIONS:

PANELIZATION OF PCBS

3. ETCHING

THE TWO PROCESSING METHODS USED TO PRODUCE A DOUBLE-SIDED   PWB WITH PLATED THROUGH HOLES.

CHEMICAL ETCHING

PCBS IN PROCESS OF HAVING COPPER PATTERN PLATED, NOTICE THE BLUE DRY FILM RESIST

4. LAMINATION

5. DRILLING

6. EXPOSED CONDUCTOR PLATING & COATING 

SOLDER RESIST

7. SCREENING

8. ASSEMBLY

THE COMPONENTS THAT ARE ASSEMBLED IN THE BOARD INCLUDE:

PCB WITH TEST CONNECTION PADS

AFTER THE BOARD HAS BEEN POPULATED IT MAY BE TESTED IN A VARIETY OF WAYS:

1. SURFACE MOUNT TECHNOLOGY

SURFACES MOUNT COMPONENTS INCLUDING RESISTORS, TRANSISTORS AND AN INTEGERATED CIRCUITS

ASSEMBLY TECHNIQUES

ADVANTAGES

THE MAIN ADVANTAGES OF SMT OVER THE OLDER THROUGH-HOLE TECHNIQUE ARE:

DISADVANTAGES

REWORK

2. THROUGH HOLE TECHNOLOGY

CHARACTERISTICS

9. TESTING

10. CUTTING INDIVIDUAL PCBS FROM THE PRODUCTION PANEL

11. FINAL INSPECTION

12. PROTECTION & PACKAGING

MARKET OVERVIEW OF PCB

INDIAN PCB (PRINTED CIRCUIT BOARD) MARKET: DRIVERS

BREAKUP BY PRODUCT TYPE:

BREAKUP BY APPLICATION:

BREAKUP BY LAYER:

BREAKUP BY SEGMENT:

BREAKUP BY LAMINATE TYPE:

BREAKUP BY MANUFACTURING TYPE:

STATE INSIGHTS:

COMPETITIVE LANDSCAPE:

SUPPLIERS OF PCB BOARD

SUPPLIERS OF PCB

SUPPLIERS OF RAW MATERIALS

SUPPLIERS OF COPPER CLAD GLASS EPOXY SHEET

SUPPLIERS OF COPPER FOIL

SUPPLIERS OF FIBRE GLASS EPOXY SHEET

SUPPLIERS OF SILK SCREEN

SUPPLIERS OF ETCHING CHEMICALS AND CLEANINGPCB CHEMICALS

SUPPLIERS OF PRINTING INK

SUPPLIERS OF BARE PCB BOARD

SUPPLIERS OF SOLDER PASTE

SUPPLIERS OF SURFACE MOUNTED DEVICES

SUPPLIERS OF PLANT AND MACHINERY

SUPPLIERS OF AUTOMATED PLOTTER

SUPPLIERS OF EXPOSURE SYSTEM

SUPPLIERS OF ETCHING CENTRE

SUPPLIERS OF CNC PCB DRILLING MACHINE

SUPPLIERS OF PCB CUTTING MACHINE

SUPPLIERS OF PCB CLEANING MACHINE

SUPPLIERS OF UV PCB CURRING MACHINE & SCREEN PRINTING MACHINE

SUPPLIERS OF DRY FILM LAMINATING MACHINE

SUPPLIERS OF COPPER PLATING MACHINE

SUPPLIERS OF PLATING THICKNESS GAUGE

SUPPLIERS OF PCB TESTING EQUIPMENT

SUPPLIERS OF PCB ASSEMBLING PLANT

SUPPLIERS OF AUTOMATIC OPTICAL INSPECTION EQUIPMENT

SUPPLIERS OF AUTOMATIC XRAY INSPECTION MACHINE

SUPPLIERS OF ELECTRICAL MEASURING INSTRUMENTS

SUPPLIERS OF AIR POLLUTION CONTROL EQUIPMENTS

SUPPLIERS OF AIR CONDITIONING EQUIPMENTS

SUPPLIERS OF PLATEFARM WEIGHING MACHINE

SUPPLIERS OF MATERIAL HANDLING EQUIPMENTS

SUPPLIERS OF FIRE FIGHTING EQUIPMENTS

APPENDIX – A:

01. PLANT ECONOMICS

02. LAND & BUILDING

03. PLANT AND MACHINERY

04. OTHER FIXED ASSESTS

05. FIXED CAPITAL

06. RAW MATERIAL

07. SALARY AND WAGES

08. UTILITIES AND OVERHEADS

09. TOTAL WORKING CAPITAL

10. TOTAL CAPITAL INVESTMENT

11. COST OF PRODUCTION

12. TURN OVER/ANNUM

13. BREAK EVEN POINT

14. RESOURCES FOR FINANCE

15. INSTALMENT PAYABLE IN 5 YEARS

16. DEPRECIATION CHART FOR 5 YEARS

17. PROFIT ANALYSIS FOR 5 YEARS

18. PROJECTED BALANCE SHEET FOR (5 YEARS)