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    Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)

    Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)
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    Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)
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      Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)

      ISBN: 9788189765675

      Price: 2200


      Chapter 1

      Introduction

      Semiconductor Device Structure

      Semiconductor Devices In Systems

      Getting Designed In

      System IP and Standards

      The Evolving Electronics Supply Chain

      Bandgap

      Crystal structure

      Doping semiconductor

      Major Fabrication Steps in (metal-oxide semiconductor) MOS Process Flow

      Model of Typical Wafer Flow in a Sub-Micron CMOS IC Fab

      Diffusion: Simplified Schematic of High-Temperature Furnace


      Chapter 2

      Promotion by Government of India

      India’s Semiconductor Sector

      India Semiconductor Mission

      India’s semiconductor program: Progress report

      Impact of the recent approvals

      The India advantage

      Pacing up of initiatives

      Inching up the value chain

      Leveraging the talent edge

      Modified Programme for Semiconductors and Display Fab Ecosystem


      Chapter 3

      Introduction to the Basic Concepts: Microchip, Conductor, Insulator and Semi-conductor

      What Is a Microchip? 

      How are microchips made?

      Types of microchips

      Manufacturing Process of Microchips: Time-Honored Techniques and Principles

      Digital Processing: The Brain of Electronic Devices

      Signal Processing and Management

      Storage and Memory: The Keepers of Data

      Control and Interface: The Command Center

      Power Management: Maximizing Efficiency

      Ohm’s Law and Resistivity

      Ohm’s Law Formulas

      Ohm’s Law Triangle

      Resistivity

      Vector Expression

      Conductor, Insulator and Semiconductor

      Band Theory

      The Definition of A Conductor

      The Definition of a Semiconductor

      The Definition of an Insulator

      Conductors

      Semiconductors

      Insulators


      Chapter 4

      Basic Knowledge of Electric Circuits

      Step 1: Open Circuit

      Step 2: Closed Circuit

      Step 3: Short Circuit

      Step 4: Series Circuit

      Advantage of series circuits

      Step 5: Parallel Circuit

      Electric Circuits and the Components

      Electric Field

      Electric Field Formula

      Electric Fields in Technology

      Magnetic Field

      Alternating Current

      Alternating Current Production

      Application of Alternating Current

      Alternating Current Waveform

      AC Alternators


      Chapter 5

      Brief Introduction of Theories

      Origin of Semiconductor

      Electronic Properties of Semi-conductor Materials

      Brief History of Integrated Circuits

      First transistor

      First integrated circuit

      The Birth of Quantum Mechanics

      Quantum Theory Development

      Impact of Quantum Theory

      Main features of quantum mechanics

      Significance of Quantum Mechanics

      Energy Band (Band)

      Introduction

      Formation of Energy Bands

      Energy Band Theory

      Valance Band

      Conduction Band

      Forbidden Gap

      Types of Energy Bands

      Insulators

      Semiconductors

      Conductors


      Chapter 6

      Early Radio Communication

      Radio Communications Comes of Age

      Cellular Technology

      Telegraph Technology

      Invention of the telegraph

      Further development of the telegraph

      Legacy of the telegraph

      Morse Code

      The Impact

      How does a telegraph work?

      Technological Advances

      Morse and His Partners

      Rival Patents

      Multilateral Oligopolies

      Mistransmission Problems

      Horizontal and System Integration

      Electron Tube

      History of Vacuum tubes

      Different Types of Vacuum Tube

      Diode Vacuum Tubes

      Triode Vacuum Tubes

      Tetrode Vacuum Tubes

      Pentode Vacuum Tubes

      Principles of Vacuum Tubes


      Chapter 7

      Transistor and Integrated Circuit

      The origin of the Transistor

      Integrated Circuit (IC)

      Integrated Circuit Design

      Digital Design

      Analog Design

      Mixed Design

      Integrated Circuit Construction

      Bipolar Transistor

      Construction of BJT

      Operation of BJT

      Types of BJTs

      NPN Transistor

      PNP Transistor

      Bipolar Transistor Configurations

      Common Base Configuration

      Characteristics curves

      Common Emitter Configuration

      Common Collector Configuration

      The Common Base Transistor Circuit

      The Common Emitter (CE) Configuration

      The Common Emitter Amplifier Circuit

      The Common Collector (CC) Configuration

      The Common Collector Transistor Circuit

      Bipolar Transistor Summary

      Bipolar Transistor Configurations

      NPN Transistor

      A Bipolar NPN Transistor Configuration

      NPN Transistor Connection

      Single Stage Common Emitter Amplifier Circuit

      PNP Transistor

      A PNP Transistor Configuration

      PNP Transistor Connection

      A PNP Transistor Circuit

      Transistor Matching

      Complementary Transistors

      Identifying the PNP Transistor

      Terminal Resistance Values for PNP and NPN Transistors

      Junction Field Effect Transistor

      The Field Effect

      The Junction Field Effect Transistor

      Biasing of an N-channel Junction Field Effect Transistor

      Junction Field effect Transistor Channel Pinched-off

      Drain current in the active region

      Drain-Source Channel Resistance

      Modes of FET’s

      Common Source (CS) Configuration

      Common Gate (CG) Configuration

      Common Drain (CD) Configuration

      The Junction Field Effect Transistor Amplifier

      Biasing of the Junction Field Effect Transistor Amplifier

      Metal-Semiconductor Field Effect Transistor (MESFET)

      Symbol of MESFET

      Structure of MESFET

      Non self aligned structure of MESFET

      Depletion mode of MESFET

      Applications of MESFET:

      Metal–Insulator–Semiconductor Field Effect Transistor

      Fabrication of devices

      Characterization


      Chapter 8

      Basic Knowledge of Process

      Backbone of IoT and digital transformation:

      Semiconductors Megatrends and Opportunities Ahead

      The role of process nodes in semiconductor technologies

      The Structure of Integrated Circuit (IC)

      Structure and composition of integrated circuits

      System level

      Module level

      Register transfer level (RTL)

      Gate level

      Transistor level

      Packages of Integrated circuit

      Resolution of Optical System

      Effects of Optical Resolution and Spatial Sampling on Data

      Effect of changing spatial sampling while using the same optical resolution

      Why Plasma Used in the Process

      Introduction

      Plasma is all around us

      Harnessing the energy of plasma

      Art of building chips

      Plasma Used In Nearly Half of The Steps

      Demand For Plasma Will Increase

      Plasma works at the atomic scale

      Perpetual search for the best plasma recipes

      More tough challenges to solve


      Chapter 9

      Semiconductor Manufacturing and Sustainability

      Historical Evolution

      Semiconductor manufacturing process overview

      Semiconductor manufacturing trends and challenges

      Semiconductor Manufacturing, the Internet of Things and Sustainability

      Sensing and data acquisition

      Processing and control

      Connectivity and communication

      Security and privacy

      Innovations In IOT Devices Driven By Semiconductor Companies

      Key Considerations For Semiconductor Design In IoT

      The Future Of Semiconductors And The Internet of Things (IoT)

      Goals of Manufacturing

      Build-In Reliability

      Manage Reliability Growth

      Failure Data Reporting

      Failure Review Board

      Corrective Action

      Reliability Testing

      Types of Reliability Tests

      Burn-in Tests

      Environmental Stress Screening Tests

      Design Verification Tests

      Reliability Development/Growth Tests

      Reliability Qualification Tests

      Generic Steps for Reliability Tests

      Test Plan Development


      Chapter 10

      Technology Over-view

      Introduction

      The fabrication of a semiconductor device

      Photomasking Process

      Metal Deposition Process

      Etching Process

      Wire Bonding

      Different Kinds of Plastic Packages

      The Transistor

      MOS Technology

      Fabrication of a transistor

      Technological Challenges

      Challenge 1: Achieving High Resolution

      Challenge 2: Ensuring Accuracy

      Challenge 3: Mass Production

      Looking Ahead

      Indian Semiconductor Scenario

      R&D in Semiconductors in India

      Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS)

      Unit Processes

      Lithography

      Etching

      Oxidation

      Deposition

      Metalization

      Ion implantation

      Diffusion

      Process Integration

      Wafer Preparation

      Isolations

      Blanket field oxide

      Local oxidation of silicon

      Shallow trench isolation

      Transistor Formation


      Chapter 11

      Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-based Materials and Beyond

      Introduction

      What is nanotechnology?

      Why Is Nanotechnology Important?

      Examples of Nanotechnology

      History of Nanotechnology

      History of Nanomaterials: From Prehistory to the Modern Age

      Faraday Experiments with Nanoparticles

      Tools of Nanotechnology in the Twentieth Century

      Transmission Electron Microscope (TEM)

      Scanning Tunnel Microscope (STM)

      Atomic Force Microscope (AFM)

      The Age of Nanotechnology from Feynman to Nano-fabrication

      Feynman the Father of Nanotechnology

      Taniguchi Coins Term Nanotechnology

      Drexler and the Coming Era of Nanotechnology

      Building on biological principles

      Silicon nanoparticles: fabrication, characterization, application and perspectives

      Carbon and Carbon Nanomaterials

      Introduction

      Atomic Structure of Carbon

      Nanotechnology Revolutionizing Wafer Manufacturing

      Driving Innovation, Collaboration, and Automation

      Nanotechnology in Wafer Fabrication

      Pioneering Nanopatterning Techniques

      Precise Nanoscale Etching and Deposition

      Nanoelectronics and Quantum Devices

      Innovative Nanomaterials for Advanced Packaging

      Nanotechnology for Sensing and MEMS Devices

      Challenges and Future Directions

      Nanofabrication Opportunities in the Semiconductor Industry

      Lithography

      Block Copolymer and Polymer Brush Lithography

      Polymer Selection

      Polymer Deposition onto Substrates

      Polymer-Based Pattern Formation

      Metal Incorporation and Oxidative Removal of the Polymer

      Nanotechnology Metrology

      Scope

      Current Scientific and Technological Advancements

      Goals, Barriers, and Solutions

      R&D Investment and Priority Research Areas

      Scientific and technical infrastructure needs

      Nanotechnology Manufacturing

      Manufacturing Approaches to Nanomaterials

      How Nanomaterials Are Used in Manufacturing

      Nanotechnology-for-semiconductors

      Semiconductor nanoparticles

      Semiconductors and Artificial Intelligence

      Designing the Chips with Artificial Intelligence

      AI-Powered Advancements in Chip Design

      Revolutionizing Semiconductor Verification and Testing for Enhanced Reliability

      Challenges in AI-Driven Chip Design

      AI in Semiconductor Industry: Use Cases

      AI’s Impact on Future Semiconductor Chip Design Trends

      Inside an AI Chip

      AI Chips in Brief

      No advanced chips, no AI applications

      Inside an AI Chip

      Microscopic view of an AI chip

      AI Chips in Brief

      No advanced chips, no AI applications

      Primer on AI Chips Fabrication

      Front End

      Back End

      Steps in semiconductor manufacturing

      Wet Etching

      Dry Etching

      Wafer Fabrication

      Summary of the major processing steps in the fabrication of a semi-conductor device


      Chapter 12

      Fundamentals of FinFET and Recent Advances in Nano-scale Silicide Formation

      Introduction

      FinFET

      SOI vs. Bulk FinFET Technology

      Use FinFETs

      Beyond FinFET and Below 5 nm

      Benefits of FinFETSoC Design

      Advances in Nanoscale Silicide Formation

      Silicide Formation

      Solid-State Amorphization

      The First Nucleated Phase and Simultaneous Occurrence of Multiphases

      Growth Kinetics of Silicides

      Dominant Diffusing Species

      Epitaxial Growth of Silicides

      Nanoscalesilicides

      Nanodots

      Self-Assembled Low-Resistivity Metal Silicide Quantum Dot Arrays on Epitaxial Si0.7Ge0.3 on (001)Si

      Formation of Epitaxial b-FeSi2 Nanodot Arrays on Strained Si/SiO.8Ge0.2 (001) Substrate

      First Nucleated Phase and the Dominant Diffusing Species

      Nanowires

      Self-Assembled Nanowires

      Alternative Growth of Silicide Nanowires

      Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT

      MEMS as a Microsensor:

      MEMS as a Microactuator-motor

      Components of Microsystems

      Typical Microsystems Products

      Inertia Sensor for “Air Bag” Deployment System

      Evolution of Microfabrication

      Application of MEMS and Microsystems in Consumer Products

      Functionalisation

      Integration

      Individualisation

      Taking mems technology to the next level

      MEMS products and services

      TECAWAFER

      Wafer manufacturing revolution: functionalisation, integration & customisation

      Wafer functionalisation

      Wafer integration

      Wafer individualisation

      Sensors: Revolutionising technology

      Sensor functionalisation

      Sensor integration

      Sensor individualisation

      Transformers

      Reliable 3D Integrated Circuits

      Benefits of 3D Integration in VLSI Circuits

      Types of 3D Integration Techniques

      Advancements in 3D Integration Technology

      Working Principles of 3D ICs

      Importance of 3D ICs

      Acceleration of Artificial Intelligence (AI)

      Addressing Moore’s Law Extension:

      Future Challenges of 3D ICs

      Design Challenges

      Standardization and Interoperability:

      Cost Considerations

      Wafer State Measurements

      Wafer Cutting

      Thin Film Deposition

      Lithography

      Capacitance-Based Technology for Non-Contact Wafer Inspection

      Proforma Technology for Non-Contact Wafer Inspection

      The Proforma 300i Manual Semiconductor Metrology System

      The Proforma 300iSA Semi-Automated Metrology System

      Wafer Edge Measurement-pinpoint precise

      Wafer Edge Measurement-Reliable Projection Technology

      Small footprint and consistent accuracy


      Chapter 13

      Epitaxy

      Types of Epitaxial Growth

      Key Parameters to Be Controlled in Epitaxial Growth

      Epitaxy Density and Rate

      Epi Process Methods

      Epitaxial Growth of Thin Film Materials and Its Applications


      Chapter 14

      Thermal Processing: Anneals, RTP and Oxidation

      Thermal Process

      Thermal Process Applications

      Material Requirements in the Thermal Process–Perfluoroelastomers

      How does Thermal Processing/Annealing work?


      Chapter 15

      Microlithography

      The Lithographic Process

      Process of semiconductor lithography

      Immersion lithography

      Multiple patterning

      Importance of Microlithography

      Photo Solutions’ Custom Microlithography Services

      Reticles

      Measuring and Calibration Standards

      Alignment Targets


      Chapter 16

      Etching

      Basic Processes

      Semiconductor Etching Products


      Chapter 17

      Ion Implantation

      Ideal product properties

      Ion Implantation Products


      Chapter 18

      Introduction to Physical Vapor Deposition

      Introduction

      The Science Behind PVD Coating

      The Role of Vacuum in PVD Coating

      The Role of Vapor in PVD Coating

      Types of PVD Coating Processes Used in Semiconductors

      Sputtering

      Vacuum chamber for thin film sputtering

      Evaporation

      Vacuum coating by thermal evaporation

      Materials Used in PVD Coating of Semiconductors

      Metals

      Ceramics

      Applications of PVD Coating in Semiconductors

      Microelectronics


      Chapter 19

      Chemical Vapor Deposition

      CVD Process in Semiconductors

      Chemical Vapor Deposition Techniques

      Atmospheric Pressure CVD (APCVD)

      Low-pressure CVD (LPCVD)

      Plasma Enhanced CVD (PECVD)

      CVD in Semiconductor Manufacturing


      Chapter 20

      Atomic Layer Deposition

      Atomic Layer Deposition

      The Atomic Layer Deposition (ALD) Process

      Comparing ALD and CLD

      Key Advantages of ALD

      ALD for Microelectronics


      Chapter 21

      Electrochemical Deposition

      Deposition process

      Process parameters

      Materials in electrochemical cell


      Chapter 22

      Fundamentals of Chemical Mechanical Planarization

      CMP in Shallow Trench Isolation Processing


      Chapter 23

      AFM Metrology

      Atomic Force Microscopy

      How an Atomic Force Microscope works

      AFM Probe Deflection

      Measuring Forces

      Feedback Loop for Atomic Force Microscopy


      Chapter 24

      Wafer Thinning and Singulation

      Introduction

      Wafer singulation process

      Methods for Wafer Thinning

      Allegro X for Wafer Packaging

      Wafer Thinning Benefits

      Wafer Thinning with Conventional Grind

      Wafer Thinning with Chemical-Mechanical Planarization (CMP)

      Wafer Thinning & Dicing


      Chapter 25

      Packaging

      Wafer-Level Packaging

      Bumping and Flip Chips

      Redistribution Layers

      Fan-Out WLP

      Through-Silicon Vias

      Packaging Technology Evolution

      Understanding Wafer Bumping Packaging Technology


      Chapter 26

      Interconnect Reliability

      Nano-Interconnects

      3D Integration

      Electromigration

      How Does Electromigration Work?

      Factors affecting electromigration:

      Stress Migration


      Chapter 27

      Automatic Test Equipment

      ATE History

      Components of an ATE system

      How is ATE used?

      Key Automation Tools

      Linear Tester

      Features

      Specification

      Mixed-Signal Tester

      Mixed-Signal IC Test and Measurement

      Purpose of Continuity Testing


      Chapter 28

      Printed Electronics: Principles, Materials, Processes, and Applications

      Printed Electronics vs. Traditional Electronic Device Manufacturing Technology

      Printed Electronics Technology

      The Concept of Printed Electronics Technology

      The Main Elements Involved in Printed Electronics Technology

      Main Elements involved in Printed Electronics

      Printing

      Functional Pattern Carrier

      Functional Electronics Inks

      Printing Materials

      Printing Pressure

      Curing/Sintering

      The Main Limitations of Printed Electronics Technology

      Printed Electronics Products and Developing Trends

      Smart Integration Systems

      Applications

      Consumer electronics

      Healthcare

      Transportation and logistics

      Internet of Things (IoT)

      RFID humidity and temperature logger for cigar packet


      Chapter 29

      Statistical Experimental Design

      Statistical Methods

      Comparing Distributions

      Analysis of Variance

      Philosophy of the Taguchi Method

      Taguchi Method Design of Experiments


      Chapter 30

      Process Modelling

      Process modelling example

      Process specification and verification


      Chapter 31

      Advanced Process Control

      Applications of APC

      Terminology:

      Run-by-Run Control with Constant Term Adaptation


      Chapter 32

      Flexible Hybrid Electronics

      Opportunities in Flexible Hybrid electronics

      Challenges in Flexible Hybrid Electronics


      Chapter 33 

      Flexible Electronics

      Fabrication Process

      Key Materials for Fabrication Process

      Technologies used in the manufacturing of Flexible Electronics

      Applications


      Chapter 34

      RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications

      Key Points in RF PCBs Manufacturing

      Substrate Material Selection

      Ensure Accuracy of High-frequency Signal in Production

      Types of RF Printed Circuit Boards

      Rigid RF PCBs

      Flexible RF PCBs

      Rigid-Flex RF PCBs

      High-Frequency RF PCBs

      RF Antenna PCBs

      Advantages of RF PCB

      Improved Signal Integrity

      Low Loss Material

      Accurate Impedance Control

      High Frequency Operations

      Better Component Placement

      Reduced Crosstalk

      Component Placement and Layout

      Signal Integrity and EMI

      Manufacturing and Testing Considerations

      Smart Skin Applications

      Smart skin patches

      Frequency

      Layout

      Shielding

      Energy Harvesting for the Internet of Things

      How it works:

      Benefits

      Applications of RF printed electronics energy harvesting in IoT


      Chapter 35

      Printing of Nanoscale Electronics and Power Electronics

      Micro Nano Printing Technologies

      Stereolithography Printing

      Two Photon Polymerization (TPP)

      Dip-Pen Nanolithography (DPN)


      Chapter 36

      3D Interconnects in Flexiible Electronics

      Flexible Electronics

      Flexible Interconnects


      Chapter 37

      Materials for the Manufacturing of an Inkjet Printed Touch Sensor

      Workflow of 3D Inkjet Printing (IJP) Fabrication for Printed IDE Capacitive Sensor

      Fabrication of FPS Using Inkjet Printer

      Verification of Printed FPS


      Chapter 38

      Flat-Panel and Flexible Display Technology

      Applications

      Technical details

      Electronic paper

      HP and ASU e-paper

      Asu e-paper

      LG e-paper

      The Future of Flexible Display Technology

      Manufacturing

      Types of Display Systems


      Chapter 39

      Photovoltaics Fundamentals, Manufacturing, Installation and Operations

      PV Module Manufacturing

      Materials


      Chapter 40

      Semiconductor Photonic Devices

      Various applications for photonic chips

      Technology

      Features

      Application


      Chapter 41

      Semiconductor Light Detection and Photocell

      Digital Camera and CCD

      Photoconductor

      Photoconductor Construction & Working Principle

      Photoconductor Working

      Photoconductivity in Semiconductors

      Uses of a Photoconductor

      Photo-diode

      Photoresistor

      Transistor Laser

      Construction of transistor

      Solar Cell

      Solar cells: production process

      Solar Cell: Technology Analysis

      High cost of equipment and materials, high engineering difficulty

      N-type IBC solar cells

      PERC solar cell efficiency potential analysis


      Chapter 42

      Dielectric Films Growth

      The Growth of Silicon Dioxide Film

      Thermal Oxidation Process

      Dry oxidation using oxygen gas

      Oxide Growth Kinetics

      Fabrication Technology of Silicon Dioxide Thin Film

      Wet Oxide method

      Sample preparation

      Procedure

      Low temperature oxide (LTO) process

      PECVD Process of Silicon Dioxide

      Deposition

      Film Quality: Moisture, Stress, and Cracking

      The Growth of Silicon Nitride Film

      Chemical Vapor Deposition

      Precursor Gas Atmosphere and Deposition Temperature

      Thermal Properties

      Physical Vapor Deposition

      LPCVD deposition of silicon oxide

      LPCVD-depostion of silicon nitrid

      LPCVD-depostion of poly-silicon

      LPCVD-depostion of metals

      PECVD Nitride

      PECVD deposition systems

      Tension, stress


      Chapter 43

      Operations, Equipment and Facilities

      Yield Management

      Strategies for Enhanced Manufacturing Efficiency

      Challenges and Solutions in Semiconductor Yield Management: A Comprehensive Overview

      The Role of Data Analytics in Semiconductor Yield Management: Leveraging Big Data for Improved Performance

      Advanced Process Control Techniques for Semiconductor Yield Improvement

      Next-Generation Technologies Driving Innovation in Semiconductor Yield Management

      CIM and Factory Automation

      MES Fundamentals

      The Functions of a Semiconductor Manufacturing Execution System

      Manufacturing Process Control

      Advanced Process Control

      Airborne Molecular Contamination

      Monitoring AMCs is Key to Contamination Prevention

      Multi-Max AMC Monitoring Solution

      Benefits

      ESD Controls in Cleanroom Environments

      ESD Control in Cleanrooms: A Simple Guide

      What is Electrostatic Discharge?

      Cleanroom Humidity Control

      Cleanroom Personnel Equipment

      Cleanroom Furniture Grounding Tabs/Drag Chains

      Cleanroom Static Dissipative Flooring

      Esd Control Footwear, Casters

      Clothing

      Vacuum Systems

      Cleanliness and Vacuum Technology in Semiconductor Manufacturing

      High-Quality Components for Semiconductor Vacuum Systems

      Semiconductor Vacuum Systems: Maintain High Purity With Swagelok Fittings

      Control of RF Plasma Processing

      The Role of Radio Frequency

      Gas Ionization Process

      Electron Heating Mechanism

      Plasma Confinement Techniques

      Technical Insights into RF Plasma Generation

      Applications of RF Plasma Generators

      IC Manufacturing Equipment Parts Cleaning Technology

      Uses of Semiconductor Cleaning Equipment

      Principle of Semiconductor Cleaning Equipment

      Types of Semiconductor Cleaning Equipment

      How to Select Semiconductor Cleaning Equipment

      Cleaning Process of Semiconductors

      Step 1: Initial Cleaning

      Step 2: Oxide Removal

      Step 3: Particle Removal

      Step 4: Chemical Cleaning

      Step 5: Final Rinse and Drying

      Step 6: Quality Control

      Vibration and Noise Design

      System Description


      Chapter 44

      Factors for Constructing Variables Control Charts

      Shewhart Control Charts for variables

      Process Capability Analysis

      General guidelines to prepare control charts

      Factors for constructing variables control charts


      Chapter 45

      Plant Economics of Integrated Circuits

      Plant Economics

      Plant & Machinery

      Fixed Capital

      Working Capital Requirement/Month

      Total Capital Investment

      Turn Over/Annum


      Chapter 46

      Plant Economics of Earth Leakage Circuit Breakers

      Plant Economics

      Land & Building

      Plant & Machinery

      Fixed Capital

      Working Capital Requirement/Month

      Total Capital Investment

      Turn Over/Annum


      Chapter 47

      Plant Economics of Electric Switches Plugs Sockets & MCB (Miniature Circuit Breaker)

      Plant Economics

      Land & Building

      Plant & Machinery

      Fixed Capital

      Working Capital Requirement/Month

      Total Capital Investment

      Turn Over/Annum


      Chapter 48

      Plant Economics of MCB (Miniature Circuit Breaker) and DB (Distribution Board)

      Plant Economics

      Land & Building

      Plant & Machinery

      Fixed Capital

      Working Capital Requirement/Month

      Total Capital Investment

      Turn Over/Annum


      Chapter 49

      Plant Economics of PCB Laminate and PCB Board

      Plant Economics

      Land & Building

      Plant & Machinery

      Fixed Capital

      Working Capital Requirement/Month

      Total Capital Investment

      Turn Over/Annum

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