Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)
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Complete Technology Handbook on Semiconductor, Microchips and Electronic Circuits with Project Profiles (Manufacturing, Fabrication and Physics)
ISBN: 9788189765675
Price: 2200
Chapter 1
Introduction
Semiconductor Device Structure
Semiconductor Devices In Systems
Getting Designed In
System IP and Standards
The Evolving Electronics Supply Chain
Bandgap
Crystal structure
Doping semiconductor
Major Fabrication Steps in (metal-oxide semiconductor) MOS Process Flow
Model of Typical Wafer Flow in a Sub-Micron CMOS IC Fab
Diffusion: Simplified Schematic of High-Temperature Furnace
Chapter 2
Promotion by Government of India
India’s Semiconductor Sector
India Semiconductor Mission
India’s semiconductor program: Progress report
Impact of the recent approvals
The India advantage
Pacing up of initiatives
Inching up the value chain
Leveraging the talent edge
Modified Programme for Semiconductors and Display Fab Ecosystem
Chapter 3
Introduction to the Basic Concepts: Microchip, Conductor, Insulator and Semi-conductor
What Is a Microchip?
How are microchips made?
Types of microchips
Manufacturing Process of Microchips: Time-Honored Techniques and Principles
Digital Processing: The Brain of Electronic Devices
Signal Processing and Management
Storage and Memory: The Keepers of Data
Control and Interface: The Command Center
Power Management: Maximizing Efficiency
Ohm’s Law and Resistivity
Ohm’s Law Formulas
Ohm’s Law Triangle
Resistivity
Vector Expression
Conductor, Insulator and Semiconductor
Band Theory
The Definition of A Conductor
The Definition of a Semiconductor
The Definition of an Insulator
Conductors
Semiconductors
Insulators
Chapter 4
Basic Knowledge of Electric Circuits
Step 1: Open Circuit
Step 2: Closed Circuit
Step 3: Short Circuit
Step 4: Series Circuit
Advantage of series circuits
Step 5: Parallel Circuit
Electric Circuits and the Components
Electric Field
Electric Field Formula
Electric Fields in Technology
Magnetic Field
Alternating Current
Alternating Current Production
Application of Alternating Current
Alternating Current Waveform
AC Alternators
Chapter 5
Brief Introduction of Theories
Origin of Semiconductor
Electronic Properties of Semi-conductor Materials
Brief History of Integrated Circuits
First transistor
First integrated circuit
The Birth of Quantum Mechanics
Quantum Theory Development
Impact of Quantum Theory
Main features of quantum mechanics
Significance of Quantum Mechanics
Energy Band (Band)
Introduction
Formation of Energy Bands
Energy Band Theory
Valance Band
Conduction Band
Forbidden Gap
Types of Energy Bands
Insulators
Semiconductors
Conductors
Chapter 6
Early Radio Communication
Radio Communications Comes of Age
Cellular Technology
Telegraph Technology
Invention of the telegraph
Further development of the telegraph
Legacy of the telegraph
Morse Code
The Impact
How does a telegraph work?
Technological Advances
Morse and His Partners
Rival Patents
Multilateral Oligopolies
Mistransmission Problems
Horizontal and System Integration
Electron Tube
History of Vacuum tubes
Different Types of Vacuum Tube
Diode Vacuum Tubes
Triode Vacuum Tubes
Tetrode Vacuum Tubes
Pentode Vacuum Tubes
Principles of Vacuum Tubes
Chapter 7
Transistor and Integrated Circuit
The origin of the Transistor
Integrated Circuit (IC)
Integrated Circuit Design
Digital Design
Analog Design
Mixed Design
Integrated Circuit Construction
Bipolar Transistor
Construction of BJT
Operation of BJT
Types of BJTs
NPN Transistor
PNP Transistor
Bipolar Transistor Configurations
Common Base Configuration
Characteristics curves
Common Emitter Configuration
Common Collector Configuration
The Common Base Transistor Circuit
The Common Emitter (CE) Configuration
The Common Emitter Amplifier Circuit
The Common Collector (CC) Configuration
The Common Collector Transistor Circuit
Bipolar Transistor Summary
Bipolar Transistor Configurations
NPN Transistor
A Bipolar NPN Transistor Configuration
NPN Transistor Connection
Single Stage Common Emitter Amplifier Circuit
PNP Transistor
A PNP Transistor Configuration
PNP Transistor Connection
A PNP Transistor Circuit
Transistor Matching
Complementary Transistors
Identifying the PNP Transistor
Terminal Resistance Values for PNP and NPN Transistors
Junction Field Effect Transistor
The Field Effect
The Junction Field Effect Transistor
Biasing of an N-channel Junction Field Effect Transistor
Junction Field effect Transistor Channel Pinched-off
Drain current in the active region
Drain-Source Channel Resistance
Modes of FET’s
Common Source (CS) Configuration
Common Gate (CG) Configuration
Common Drain (CD) Configuration
The Junction Field Effect Transistor Amplifier
Biasing of the Junction Field Effect Transistor Amplifier
Metal-Semiconductor Field Effect Transistor (MESFET)
Symbol of MESFET
Structure of MESFET
Non self aligned structure of MESFET
Depletion mode of MESFET
Applications of MESFET:
Metal–Insulator–Semiconductor Field Effect Transistor
Fabrication of devices
Characterization
Chapter 8
Basic Knowledge of Process
Backbone of IoT and digital transformation:
Semiconductors Megatrends and Opportunities Ahead
The role of process nodes in semiconductor technologies
The Structure of Integrated Circuit (IC)
Structure and composition of integrated circuits
System level
Module level
Register transfer level (RTL)
Gate level
Transistor level
Packages of Integrated circuit
Resolution of Optical System
Effects of Optical Resolution and Spatial Sampling on Data
Effect of changing spatial sampling while using the same optical resolution
Why Plasma Used in the Process
Introduction
Plasma is all around us
Harnessing the energy of plasma
Art of building chips
Plasma Used In Nearly Half of The Steps
Demand For Plasma Will Increase
Plasma works at the atomic scale
Perpetual search for the best plasma recipes
More tough challenges to solve
Chapter 9
Semiconductor Manufacturing and Sustainability
Historical Evolution
Semiconductor manufacturing process overview
Semiconductor manufacturing trends and challenges
Semiconductor Manufacturing, the Internet of Things and Sustainability
Sensing and data acquisition
Processing and control
Connectivity and communication
Security and privacy
Innovations In IOT Devices Driven By Semiconductor Companies
Key Considerations For Semiconductor Design In IoT
The Future Of Semiconductors And The Internet of Things (IoT)
Goals of Manufacturing
Build-In Reliability
Manage Reliability Growth
Failure Data Reporting
Failure Review Board
Corrective Action
Reliability Testing
Types of Reliability Tests
Burn-in Tests
Environmental Stress Screening Tests
Design Verification Tests
Reliability Development/Growth Tests
Reliability Qualification Tests
Generic Steps for Reliability Tests
Test Plan Development
Chapter 10
Technology Over-view
Introduction
The fabrication of a semiconductor device
Photomasking Process
Metal Deposition Process
Etching Process
Wire Bonding
Different Kinds of Plastic Packages
The Transistor
MOS Technology
Fabrication of a transistor
Technological Challenges
Challenge 1: Achieving High Resolution
Challenge 2: Ensuring Accuracy
Challenge 3: Mass Production
Looking Ahead
Indian Semiconductor Scenario
R&D in Semiconductors in India
Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS)
Unit Processes
Lithography
Etching
Oxidation
Deposition
Metalization
Ion implantation
Diffusion
Process Integration
Wafer Preparation
Isolations
Blanket field oxide
Local oxidation of silicon
Shallow trench isolation
Transistor Formation
Chapter 11
Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-based Materials and Beyond
Introduction
What is nanotechnology?
Why Is Nanotechnology Important?
Examples of Nanotechnology
History of Nanotechnology
History of Nanomaterials: From Prehistory to the Modern Age
Faraday Experiments with Nanoparticles
Tools of Nanotechnology in the Twentieth Century
Transmission Electron Microscope (TEM)
Scanning Tunnel Microscope (STM)
Atomic Force Microscope (AFM)
The Age of Nanotechnology from Feynman to Nano-fabrication
Feynman the Father of Nanotechnology
Taniguchi Coins Term Nanotechnology
Drexler and the Coming Era of Nanotechnology
Building on biological principles
Silicon nanoparticles: fabrication, characterization, application and perspectives
Carbon and Carbon Nanomaterials
Introduction
Atomic Structure of Carbon
Nanotechnology Revolutionizing Wafer Manufacturing
Driving Innovation, Collaboration, and Automation
Nanotechnology in Wafer Fabrication
Pioneering Nanopatterning Techniques
Precise Nanoscale Etching and Deposition
Nanoelectronics and Quantum Devices
Innovative Nanomaterials for Advanced Packaging
Nanotechnology for Sensing and MEMS Devices
Challenges and Future Directions
Nanofabrication Opportunities in the Semiconductor Industry
Lithography
Block Copolymer and Polymer Brush Lithography
Polymer Selection
Polymer Deposition onto Substrates
Polymer-Based Pattern Formation
Metal Incorporation and Oxidative Removal of the Polymer
Nanotechnology Metrology
Scope
Current Scientific and Technological Advancements
Goals, Barriers, and Solutions
R&D Investment and Priority Research Areas
Scientific and technical infrastructure needs
Nanotechnology Manufacturing
Manufacturing Approaches to Nanomaterials
How Nanomaterials Are Used in Manufacturing
Nanotechnology-for-semiconductors
Semiconductor nanoparticles
Semiconductors and Artificial Intelligence
Designing the Chips with Artificial Intelligence
AI-Powered Advancements in Chip Design
Revolutionizing Semiconductor Verification and Testing for Enhanced Reliability
Challenges in AI-Driven Chip Design
AI in Semiconductor Industry: Use Cases
AI’s Impact on Future Semiconductor Chip Design Trends
Inside an AI Chip
AI Chips in Brief
No advanced chips, no AI applications
Inside an AI Chip
Microscopic view of an AI chip
AI Chips in Brief
No advanced chips, no AI applications
Primer on AI Chips Fabrication
Front End
Back End
Steps in semiconductor manufacturing
Wet Etching
Dry Etching
Wafer Fabrication
Summary of the major processing steps in the fabrication of a semi-conductor device
Chapter 12
Fundamentals of FinFET and Recent Advances in Nano-scale Silicide Formation
Introduction
FinFET
SOI vs. Bulk FinFET Technology
Use FinFETs
Beyond FinFET and Below 5 nm
Benefits of FinFETSoC Design
Advances in Nanoscale Silicide Formation
Silicide Formation
Solid-State Amorphization
The First Nucleated Phase and Simultaneous Occurrence of Multiphases
Growth Kinetics of Silicides
Dominant Diffusing Species
Epitaxial Growth of Silicides
Nanoscalesilicides
Nanodots
Self-Assembled Low-Resistivity Metal Silicide Quantum Dot Arrays on Epitaxial Si0.7Ge0.3 on (001)Si
Formation of Epitaxial b-FeSi2 Nanodot Arrays on Strained Si/SiO.8Ge0.2 (001) Substrate
First Nucleated Phase and the Dominant Diffusing Species
Nanowires
Self-Assembled Nanowires
Alternative Growth of Silicide Nanowires
Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT
MEMS as a Microsensor:
MEMS as a Microactuator-motor
Components of Microsystems
Typical Microsystems Products
Inertia Sensor for “Air Bag” Deployment System
Evolution of Microfabrication
Application of MEMS and Microsystems in Consumer Products
Functionalisation
Integration
Individualisation
Taking mems technology to the next level
MEMS products and services
TECAWAFER
Wafer manufacturing revolution: functionalisation, integration & customisation
Wafer functionalisation
Wafer integration
Wafer individualisation
Sensors: Revolutionising technology
Sensor functionalisation
Sensor integration
Sensor individualisation
Transformers
Reliable 3D Integrated Circuits
Benefits of 3D Integration in VLSI Circuits
Types of 3D Integration Techniques
Advancements in 3D Integration Technology
Working Principles of 3D ICs
Importance of 3D ICs
Acceleration of Artificial Intelligence (AI)
Addressing Moore’s Law Extension:
Future Challenges of 3D ICs
Design Challenges
Standardization and Interoperability:
Cost Considerations
Wafer State Measurements
Wafer Cutting
Thin Film Deposition
Lithography
Capacitance-Based Technology for Non-Contact Wafer Inspection
Proforma Technology for Non-Contact Wafer Inspection
The Proforma 300i Manual Semiconductor Metrology System
The Proforma 300iSA Semi-Automated Metrology System
Wafer Edge Measurement-pinpoint precise
Wafer Edge Measurement-Reliable Projection Technology
Small footprint and consistent accuracy
Chapter 13
Epitaxy
Types of Epitaxial Growth
Key Parameters to Be Controlled in Epitaxial Growth
Epitaxy Density and Rate
Epi Process Methods
Epitaxial Growth of Thin Film Materials and Its Applications
Chapter 14
Thermal Processing: Anneals, RTP and Oxidation
Thermal Process
Thermal Process Applications
Material Requirements in the Thermal Process–Perfluoroelastomers
How does Thermal Processing/Annealing work?
Chapter 15
Microlithography
The Lithographic Process
Process of semiconductor lithography
Immersion lithography
Multiple patterning
Importance of Microlithography
Photo Solutions’ Custom Microlithography Services
Reticles
Measuring and Calibration Standards
Alignment Targets
Chapter 16
Etching
Basic Processes
Semiconductor Etching Products
Chapter 17
Ion Implantation
Ideal product properties
Ion Implantation Products
Chapter 18
Introduction to Physical Vapor Deposition
Introduction
The Science Behind PVD Coating
The Role of Vacuum in PVD Coating
The Role of Vapor in PVD Coating
Types of PVD Coating Processes Used in Semiconductors
Sputtering
Vacuum chamber for thin film sputtering
Evaporation
Vacuum coating by thermal evaporation
Materials Used in PVD Coating of Semiconductors
Metals
Ceramics
Applications of PVD Coating in Semiconductors
Microelectronics
Chapter 19
Chemical Vapor Deposition
CVD Process in Semiconductors
Chemical Vapor Deposition Techniques
Atmospheric Pressure CVD (APCVD)
Low-pressure CVD (LPCVD)
Plasma Enhanced CVD (PECVD)
CVD in Semiconductor Manufacturing
Chapter 20
Atomic Layer Deposition
Atomic Layer Deposition
The Atomic Layer Deposition (ALD) Process
Comparing ALD and CLD
Key Advantages of ALD
ALD for Microelectronics
Chapter 21
Electrochemical Deposition
Deposition process
Process parameters
Materials in electrochemical cell
Chapter 22
Fundamentals of Chemical Mechanical Planarization
CMP in Shallow Trench Isolation Processing
Chapter 23
AFM Metrology
Atomic Force Microscopy
How an Atomic Force Microscope works
AFM Probe Deflection
Measuring Forces
Feedback Loop for Atomic Force Microscopy
Chapter 24
Wafer Thinning and Singulation
Introduction
Wafer singulation process
Methods for Wafer Thinning
Allegro X for Wafer Packaging
Wafer Thinning Benefits
Wafer Thinning with Conventional Grind
Wafer Thinning with Chemical-Mechanical Planarization (CMP)
Wafer Thinning & Dicing
Chapter 25
Packaging
Wafer-Level Packaging
Bumping and Flip Chips
Redistribution Layers
Fan-Out WLP
Through-Silicon Vias
Packaging Technology Evolution
Understanding Wafer Bumping Packaging Technology
Chapter 26
Interconnect Reliability
Nano-Interconnects
3D Integration
Electromigration
How Does Electromigration Work?
Factors affecting electromigration:
Stress Migration
Chapter 27
Automatic Test Equipment
ATE History
Components of an ATE system
How is ATE used?
Key Automation Tools
Linear Tester
Features
Specification
Mixed-Signal Tester
Mixed-Signal IC Test and Measurement
Purpose of Continuity Testing
Chapter 28
Printed Electronics: Principles, Materials, Processes, and Applications
Printed Electronics vs. Traditional Electronic Device Manufacturing Technology
Printed Electronics Technology
The Concept of Printed Electronics Technology
The Main Elements Involved in Printed Electronics Technology
Main Elements involved in Printed Electronics
Printing
Functional Pattern Carrier
Functional Electronics Inks
Printing Materials
Printing Pressure
Curing/Sintering
The Main Limitations of Printed Electronics Technology
Printed Electronics Products and Developing Trends
Smart Integration Systems
Applications
Consumer electronics
Healthcare
Transportation and logistics
Internet of Things (IoT)
RFID humidity and temperature logger for cigar packet
Chapter 29
Statistical Experimental Design
Statistical Methods
Comparing Distributions
Analysis of Variance
Philosophy of the Taguchi Method
Taguchi Method Design of Experiments
Chapter 30
Process Modelling
Process modelling example
Process specification and verification
Chapter 31
Advanced Process Control
Applications of APC
Terminology:
Run-by-Run Control with Constant Term Adaptation
Chapter 32
Flexible Hybrid Electronics
Opportunities in Flexible Hybrid electronics
Challenges in Flexible Hybrid Electronics
Chapter 33
Flexible Electronics
Fabrication Process
Key Materials for Fabrication Process
Technologies used in the manufacturing of Flexible Electronics
Applications
Chapter 34
RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications
Key Points in RF PCBs Manufacturing
Substrate Material Selection
Ensure Accuracy of High-frequency Signal in Production
Types of RF Printed Circuit Boards
Rigid RF PCBs
Flexible RF PCBs
Rigid-Flex RF PCBs
High-Frequency RF PCBs
RF Antenna PCBs
Advantages of RF PCB
Improved Signal Integrity
Low Loss Material
Accurate Impedance Control
High Frequency Operations
Better Component Placement
Reduced Crosstalk
Component Placement and Layout
Signal Integrity and EMI
Manufacturing and Testing Considerations
Smart Skin Applications
Smart skin patches
Frequency
Layout
Shielding
Energy Harvesting for the Internet of Things
How it works:
Benefits
Applications of RF printed electronics energy harvesting in IoT
Chapter 35
Printing of Nanoscale Electronics and Power Electronics
Micro Nano Printing Technologies
Stereolithography Printing
Two Photon Polymerization (TPP)
Dip-Pen Nanolithography (DPN)
Chapter 36
3D Interconnects in Flexiible Electronics
Flexible Electronics
Flexible Interconnects
Chapter 37
Materials for the Manufacturing of an Inkjet Printed Touch Sensor
Workflow of 3D Inkjet Printing (IJP) Fabrication for Printed IDE Capacitive Sensor
Fabrication of FPS Using Inkjet Printer
Verification of Printed FPS
Chapter 38
Flat-Panel and Flexible Display Technology
Applications
Technical details
Electronic paper
HP and ASU e-paper
Asu e-paper
LG e-paper
The Future of Flexible Display Technology
Manufacturing
Types of Display Systems
Chapter 39
Photovoltaics Fundamentals, Manufacturing, Installation and Operations
PV Module Manufacturing
Materials
Chapter 40
Semiconductor Photonic Devices
Various applications for photonic chips
Technology
Features
Application
Chapter 41
Semiconductor Light Detection and Photocell
Digital Camera and CCD
Photoconductor
Photoconductor Construction & Working Principle
Photoconductor Working
Photoconductivity in Semiconductors
Uses of a Photoconductor
Photo-diode
Photoresistor
Transistor Laser
Construction of transistor
Solar Cell
Solar cells: production process
Solar Cell: Technology Analysis
High cost of equipment and materials, high engineering difficulty
N-type IBC solar cells
PERC solar cell efficiency potential analysis
Chapter 42
Dielectric Films Growth
The Growth of Silicon Dioxide Film
Thermal Oxidation Process
Dry oxidation using oxygen gas
Oxide Growth Kinetics
Fabrication Technology of Silicon Dioxide Thin Film
Wet Oxide method
Sample preparation
Procedure
Low temperature oxide (LTO) process
PECVD Process of Silicon Dioxide
Deposition
Film Quality: Moisture, Stress, and Cracking
The Growth of Silicon Nitride Film
Chemical Vapor Deposition
Precursor Gas Atmosphere and Deposition Temperature
Thermal Properties
Physical Vapor Deposition
LPCVD deposition of silicon oxide
LPCVD-depostion of silicon nitrid
LPCVD-depostion of poly-silicon
LPCVD-depostion of metals
PECVD Nitride
PECVD deposition systems
Tension, stress
Chapter 43
Operations, Equipment and Facilities
Yield Management
Strategies for Enhanced Manufacturing Efficiency
Challenges and Solutions in Semiconductor Yield Management: A Comprehensive Overview
The Role of Data Analytics in Semiconductor Yield Management: Leveraging Big Data for Improved Performance
Advanced Process Control Techniques for Semiconductor Yield Improvement
Next-Generation Technologies Driving Innovation in Semiconductor Yield Management
CIM and Factory Automation
MES Fundamentals
The Functions of a Semiconductor Manufacturing Execution System
Manufacturing Process Control
Advanced Process Control
Airborne Molecular Contamination
Monitoring AMCs is Key to Contamination Prevention
Multi-Max AMC Monitoring Solution
Benefits
ESD Controls in Cleanroom Environments
ESD Control in Cleanrooms: A Simple Guide
What is Electrostatic Discharge?
Cleanroom Humidity Control
Cleanroom Personnel Equipment
Cleanroom Furniture Grounding Tabs/Drag Chains
Cleanroom Static Dissipative Flooring
Esd Control Footwear, Casters
Clothing
Vacuum Systems
Cleanliness and Vacuum Technology in Semiconductor Manufacturing
High-Quality Components for Semiconductor Vacuum Systems
Semiconductor Vacuum Systems: Maintain High Purity With Swagelok Fittings
Control of RF Plasma Processing
The Role of Radio Frequency
Gas Ionization Process
Electron Heating Mechanism
Plasma Confinement Techniques
Technical Insights into RF Plasma Generation
Applications of RF Plasma Generators
IC Manufacturing Equipment Parts Cleaning Technology
Uses of Semiconductor Cleaning Equipment
Principle of Semiconductor Cleaning Equipment
Types of Semiconductor Cleaning Equipment
How to Select Semiconductor Cleaning Equipment
Cleaning Process of Semiconductors
Step 1: Initial Cleaning
Step 2: Oxide Removal
Step 3: Particle Removal
Step 4: Chemical Cleaning
Step 5: Final Rinse and Drying
Step 6: Quality Control
Vibration and Noise Design
System Description
Chapter 44
Factors for Constructing Variables Control Charts
Shewhart Control Charts for variables
Process Capability Analysis
General guidelines to prepare control charts
Factors for constructing variables control charts
Chapter 45
Plant Economics of Integrated Circuits
Plant Economics
Plant & Machinery
Fixed Capital
Working Capital Requirement/Month
Total Capital Investment
Turn Over/Annum
Chapter 46
Plant Economics of Earth Leakage Circuit Breakers
Plant Economics
Land & Building
Plant & Machinery
Fixed Capital
Working Capital Requirement/Month
Total Capital Investment
Turn Over/Annum
Chapter 47
Plant Economics of Electric Switches Plugs Sockets & MCB (Miniature Circuit Breaker)
Plant Economics
Land & Building
Plant & Machinery
Fixed Capital
Working Capital Requirement/Month
Total Capital Investment
Turn Over/Annum
Chapter 48
Plant Economics of MCB (Miniature Circuit Breaker) and DB (Distribution Board)
Plant Economics
Land & Building
Plant & Machinery
Fixed Capital
Working Capital Requirement/Month
Total Capital Investment
Turn Over/Annum
Chapter 49
Plant Economics of PCB Laminate and PCB Board
Plant Economics
Land & Building
Plant & Machinery
Fixed Capital
Working Capital Requirement/Month
Total Capital Investment
Turn Over/Annum
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